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Presented several papers that demonstrate ultimate single-exposure patterning capability of today’s 0.33NA NXE:3400 extreme ultraviolet lithography.
February 24, 2021
By: Anthony Locicero
Copy editor, New York Post
At the 2021 SPIE Advanced Lithography Conference, imec and ASML, the world’s leading manufacturer of semiconductor lithography equipment, presented several papers that demonstrate the ultimate single-exposure patterning capability of today’s 0.33NA NXE:3400 extreme ultraviolet lithography (EUVL). Process optimizations have enabled the patterning of dense 28nm pitch line/spaces with an Inpria metal-oxide resist in one single exposure, relevant for high-volume manufacturing. For the ...
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